Iei-integration ICE-DB-T6 Manuel d'utilisateur télécharger pdf (Page 89)

Type 6 Carrier Board Design Guide

Page 79

Figure 5-6: Overall Height for Heatspreader in Basic and Extended Modules

All dimensions in mm. Tolerances (unless otherwise specified): Z (height) dimensions

should be ± 0.8mm [±0.031”] from top of carrier board to top of heatspreader.

Heatspreader surface should be flat within 0.2mm [.008"] after assembly. Interface surface

finish should have a maximum roughness average (Ra) of 1.6μm [63μin]. The critical

dimension in Figure 6-8 is the module PCB bottom side to heatspreader top side. This

dimension shall be 13.00mm ± 0.65mm [±0.026”]. Figure 6-8 shows a cross section of a

module and heatspreader assembled to a Carrier Board using the 5mm stack height

option. If 8mm Carrier Board connectors are used, the overall assembly height increases

from 18.00mm to 21.00mm.

Figure 5-7: Basic Module Heatspreader

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Iei-integration ICE-DB-T6 Manuel d'utilisateur Page 89